Wednesday, June 17, 2009

Thermaltake Spedo

Think excitement - Think Spedo! At least that's Thermaltakes' spin on it. But what's in a name anyway? Well, a lot less than what's packed inside this Spedo... Spedo Advance Package gaming chassis that is. Name aside this case at first glance appears to have a lot going for it. It has a laundry list that would rival St. Nicks naughty/nice list in length, items such as Advanced Thermal Chambers (A.T.C. 3) and Cable Routing Management (C.R.M. 3). Is all this stuff needed or is this a gimmick? Benchmark Reviews will take a closer look at the outwardly impressive Spedo Advanced Package full tower case (model VI90001W2Z) and see if this is eye candy or the real deal. My hopes are high as this is really the first case that I've reviewed that has many of missing elements on my cons list of previous chassis reviews.

The Spedo Advance is Thermaltakes attempt at improved thermal management through better airflow direction while also separating each heat source from one another with strategically placed plastic inserts. In theory this should allow each heat source to cool itself better by not introducing additional heat from the other sources.

These air chambers are combined with an excellent cable management system to offer a unique spin on component cooling. On top of all of that, throw in six included fans (3 x 120mm, 1 x 140mm and 2 x 230mm) with two optional locations for fans and you can see the Spedo Advance chassis takes cooling seriously.

thermaltake_spedo_advance_airflow.jpg

As you can see in the image above there are many vents, channels, intakes and exhausts. This is a huge departure from the typical tried and true in lower front out upper rear approach. Think Spedo, think excitement. Well I truly am excited to try this chassis out. As stated above it has many features I've felt have been missing in so many chassis designs. Let's move on and see how all this pans out.

Spedo Advance Package Features

  • A.T.C.3 - Advance Thermal Chamber 3 provides maximum cooling & prevent hot air re-circulation
  • C.R.M.3 - Cable Routing Management 3 eliminates cable cluster
  • Independent Adjustable Fan bar
  • Advance cable routing
  • HDD Relocation canister
  • Tool free design
  • Fancool 8 - Installed up to 8 fans
  • Wire-less side panel 23cm fan
  • Superior air circulation design

VI90001W2Z Specifications

  • Model VI90001W2Z
  • Case Type Full Tower
  • Material SECC 0.8 mm
  • Front Bezel Material Metal Mesh
  • Color Black
  • Side Panel Transparent window
  • Motherboard Support ATX, M-ATX
  • Motherboard Tray No
  • 5.25" Drive Bay 7
  • Ext. 3.5" Drive Bay 1 (convertable from 5.25")
  • Int. 3.5" Drive Bay 6
  • Expansion Slots 8
  • Front I/O Ports USB 2.0 x 2, eSATA x 1, HD Audio
  • Power Supply Supported Standard ATX PS2
  • Power Supply Included No
  • Dimension (H*W*D) 24.0 x 9.1 x 21.1 in, 610 x 232 x 536 mm