AMD® Phenom™ X4/ Phenom™ X3/ Athlon™ X2/ Athlon™/ Sempron™ processors (socket AM2+/AM2)
Think excitement - Think Spedo! At least that's Thermaltakes' spin on it. But what's in a name anyway? Well, a lot less than what's packed inside this Spedo... Spedo Advance Package gaming chassis that is. Name aside this case at first glance appears to have a lot going for it. It has a laundry list that would rival St. Nicks naughty/nice list in length, items such as Advanced Thermal Chambers (A.T.C. 3) and Cable Routing Management (C.R.M. 3). Is all this stuff needed or is this a gimmick? Benchmark Reviews will take a closer look at the outwardly impressive Spedo Advanced Package full tower case (model VI90001W2Z) and see if this is eye candy or the real deal. My hopes are high as this is really the first case that I've reviewed that has many of missing elements on my cons list of previous chassis reviews.
The Spedo Advance is Thermaltakes attempt at improved thermal management through better airflow direction while also separating each heat source from one another with strategically placed plastic inserts. In theory this should allow each heat source to cool itself better by not introducing additional heat from the other sources.
These air chambers are combined with an excellent cable management system to offer a unique spin on component cooling. On top of all of that, throw in six included fans (3 x 120mm, 1 x 140mm and 2 x 230mm) with two optional locations for fans and you can see the Spedo Advance chassis takes cooling seriously.
As you can see in the image above there are many vents, channels, intakes and exhausts. This is a huge departure from the typical tried and true in lower front out upper rear approach. Think Spedo, think excitement. Well I truly am excited to try this chassis out. As stated above it has many features I've felt have been missing in so many chassis designs. Let's move on and see how all this pans out.
Dimension (H*W*D) 24.0 x 9.1 x 21.1 in, 610 x 232 x 536 mm
With the success of the Armor full tower launched over two years ago, Thermaltake is introducing the most powerful version in the Armor family, the new Armor+ Chassis. While all the essence of Armor has been maintained, Armor+ comes with many market leading features that are never seen in any Chassis on the market today. With the release of previous online preview that left gamers tingle with excitements; Thermaltake is launching the exclusive website of Armor+ with global market availability schedules today!
Born to feed the beasts, the Armor+ has been granted. With bravely implanted features like the 10 PCI slots, 14 drive bay expandability and adjustable PSU supporting bridge; fitting everything from micro-ATX to extended-ATX motherboard and even quad-graphic cards, the extremely spacious Armor+ is tailored for the top-end enthusiasts.
With extra careful concerns on the user experiences, not only the 5.25", 3.5" devices and PCI slots are designed tool-free, but the further careful touch on the motherboard tray and cable management functions also enhanced the installation convenience. Moreover, Armor+ offers superb ventilation with the entire body metal grilled and well organized fan cooling system managing CPU, VGA and HDD thermal independently for optimized system airflow.
The liquid-cooling version of Armor+ will also be available in the near future. The embedded 3 bay liquid cooling system with 5 steps instant setup and external coolant maintenance features will definitely show you the innovation and technology that Thermaltake is famed for.
Not just the fascinating internal features that satisfy all heavy demands, the solid constructions and streamline appearance of Armor+ inherited the fine tradition with good strains of seeds from Armor. Experience the beauty and innovation breakthrough from the new Thermaltake Armor+ exclusive website with most updated info on the global market availability!
Thermaltake is well known for its innovative and creative Chassis, Cooler, and Power Supply among enthusiasts worldwide; the products are not only preferred by gamers and enthusiasts, they are often being imitated by industry competitors. With such popularity among end-users and prestigious reputation in the industry, Thermaltake announces today its endorsement of the new Enthusiast System Architecture (ESA) industry with plans to introduce ESA-certified components in the near future.
"ESA is an open standard that enables components such as chassis, power supplies, and water cooling systems to communicate status and control in real-time." said Waleed Zamel, Technical Marketing Manager at NVIDIA. "ESA-compliant applications provide enthusiasts with unprecedented software control to achieve better performance, optimal thermal and acoustic operating environments. By providing ESA-compliant Chassis, Liquid Cooler, and Power Supplies, our partner Thermaltake is enabling users to exploit the full potential of the hardware. This kind of engineering cooperation is targeted to enable our mutual enthusiast customers to push the technology to new heights."
Peter Pan, General Manager of Thermaltake comments, "Thermaltake has spent the past 7 years in developing enthusiast-related chassis, coolers, and power supplies. We are excited about the development of ESA, and believe it will create a synergy within the PC component industry to stimulate the growth of gaming and DIY market and bring it to a whole new level."
